MANUFACTURING TECHNOLOGIES

TE is a leading supplier of molded interconnect device

(MID) technology with more than 25 years mass production

experience. LDS is an exciting technology used to create MIDs.

LDS can save valuable space in your application by integrating

high frequency, mechanical and electrical functionality into

one component. Laser structuring enables 3-dimensional (3D)

design/routing capability, versus the limiting 2-dimensional (2D)

capability on a printed circuit board (PCB) or other common

substrates.

LDS technology also allows for improved antenna performance

because antennas can be placed in the design where they have

more room for better bandwidth and efficiency. 

TE has deep experience in various printed electronics technologies, covering ink technologies and printing techniques. Our ink

technology research includes custom ink formulation in conductive, magnetic, and other functional inks, in addition to access and

experience with various commercially available inks. Our printing capabilities can cover analog and digital printing techniques of

2D and 3D surfaces. TE’s process and product development focus areas include antennas, sensors, passive components, in-mold

electronics, electrodes & contacts, and medical devices. 

Contact TE for more information.

TE has been a leader in early adoption of LDS manufacturing

process technology, giving us the experience to help get the

design solution correct with minimal effort. Our in-house

development and fully integrated manufacturing means we

can better control the process and timing from end-to-end and

can transition quickly from prototype to mass production –

helping delivering your product fast to increase your speed to

market.

The use of LDS technology is not limited to antennas,  and

also  includes electro-mechanical, shielding, and other

components used in a wide variety of applications.

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Laser Direct Structuring (LDS)

Printed Electronics

•

Ability to selectively and repeatably plate 3

dimensionally

•

Space savings

•

Ability to produce thin (0.15 mm) traces

•

Improved antenna performance

•

Applied cost savings

•

Fast time to market

•

Flexibility for pattern changes during

production

•

Simple/fast/low cost tooling

Key benefits