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ADP1974ARUZ-R7 Datasheet(PDF) 18 Page - Analog Devices

Part # ADP1974ARUZ-R7
Description  Bidirectional, Synchronous PWM Controller for Battery Test and Formation
PDF  19 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADP1974ARUZ-R7 Datasheet(HTML) 18 Page - Analog Devices

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ADP1974
Data Sheet
Rev. 0 | Page 18 of 19
PCB LAYOUT GUIDELINES
For high efficiency, good regulation, and stability, a well designed
PCB layout is required.
Use the following guidelines when designing the PCB (see
Figure 20 for the block diagram and Figure 2 for the pin
configuration):
Keep the low effective series resistance (ESR) input supply
capacitor (CIN) for VIN as close as possible to the VIN and
GND pins to minimize noise injected into the device from
board parasitic inductance.
Keep the low ESR input supply capacitor (CVREG) for VREG as
close as possible to the VREG and GND pins to minimize the
noise injected into the device from board parasitic inductance.
Place the components for the SCFG, FREQ, DMAX, and SS
pins close to the corresponding pins. Tie these components
collectively to an analog ground plane that makes a Kelvin
connection to the GND pin.
Keep the trace from the COMP pin to the accompanying
device (for example, the AD8450) as short as possible. Avoid
routing this trace near switching signals, and shield the trace,
if possible.
Place any trace or components for the SYNC pin away from
sensitive analog nodes. When using an external pull-up
resistor, it is best to use a local 0.1 μF bypass capacitor from
the supply of the pull-up resistor to GND.
Keep the traces from the DH and DL pins to the external
components as short as possible to minimize parasitic
inductance and capacitance, which affect the control
signal. The DH and DL pins are switching nodes; do not
route them near any sensitive analog circuitry.
Keep high current traces as short and as wide as possible.
Connect the ground connection of the ADP1974 directly
to the ground connection of the current sense resistor (RS).
Connect CL through a 20 kΩ resistor directly to RS.
From the ground connection shown in Figure 32, connect
the following:
The GND pin to the ground point for RS
The system power ground bus to the ground point of RS
When building a system with a master and multiple slave
devices, minimize the capacitance of the trace attached to
the SYNC pin by considering the following items:
For small systems with only a few slave devices, a
resistor connected in series between the master SYNC
signal and the slave SYNC input pins limits the
capacitance of the trace and reduces the fast ground
currents that can inject noise into the master device.
For larger applications, the series resistance is not
enough to isolate the master SYNC clock. In larger
systems, use an external buffer to reduce the
capacitance of the trace. The external buffer has the
drive capability to support a large number of slave
devices.
RS
GND
CL
RCL
20kΩ
NMOS
POWER
FET
SOURCE
GROUND
BUS
Figure 32. Recommended RS Kelvin Ground Connection



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