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TSB582 Datasheet(PDF) 31 Page - STMicroelectronics |
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TSB582 Datasheet(HTML) 31 Page - STMicroelectronics |
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31 / 34 page ![]() Contents 1 Pin configuration ..................................................................2 2 Maximum ratings ..................................................................3 2.1 Operating condition............................................................. 3 3 Electrical characteristics...........................................................4 4 Typical performance characteristics ..............................................10 5 Application information ...........................................................17 5.1 Operating voltages ............................................................ 17 5.2 ESD and input protection ....................................................... 17 5.3 EMI rejection ................................................................. 17 5.4 Input offset voltage drift versus temperature ....................................... 18 5.5 Maximum power dissipation..................................................... 18 5.6 Thermal shutdown considerations ............................................... 19 5.7 Safe operating area ........................................................... 19 5.8 Capacitive load and stability .................................................... 20 5.9 PCB layout recommendations ................................................... 21 5.10 Decoupling capacitor .......................................................... 21 6 Typical applications ..............................................................22 6.1 Rotary resolver ............................................................... 22 6.2 Design requirements........................................................... 22 6.3 Increasing output current ....................................................... 23 7 Package information..............................................................24 7.1 SO8 exposed pad package information ........................................... 25 7.2 DFN8 3x3 exposed pad, wettable flank package information ......................... 27 8 Ordering information .............................................................29 Revision history .......................................................................30 TSB582 Contents DS13378 - Rev 2 page 31/34 |
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