Si5350B-B

10

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Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021

Table 12. Thermal Characteristics (Junction-to-Case)

Parameter

Symbol

Test Condition

Package

Value

Unit

Thermal Resistance

Junction to Case1

JC

Still Air

10-MSOP

36

°C/W

16-QFN

82

°C/W

20-QFN

51

°C/W

Notes:

1. Based on board designed per JESD51-1 (Top center of packages used).

Table 13. Absolute Maximum Ratings1

Parameter

Symbol

Test Condition

Value

Unit

DC Supply Voltage

VDD_max

–0.5 to 3.8

V

Input Voltage

VIN_P0-3

Pins P0, P1, P2, P3

–0.5 to 3.8

V

VIN_VC

VC

–0.5 to (VDD+0.3)

V

VIN_XA/B

Pins XA, XB

–0.5 to 1.3 V

V

Junction Temperature

TJ

–55 to 150

°C

Soldering Temperature

(Pb-free profile)2

TPEAK

260

°C

Soldering Temperature Time at

TPEAK (Pb-free profile)2

TP

20–40

Sec

Notes:

1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be

restricted to the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum

rating conditions for extended periods may affect device reliability.

2. The device is compliant with JEDEC J-STD-020.