Si5350C-B

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

9

Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021

Table 11. Thermal Characteristics (4-Layer Board)

Parameter

Symbol

Test Condition

Package

Value

Unit

Thermal Resistance

Junction to Ambient

JA

Still Air1

10-MSOP

126

°C/W

16-QFN

65

°C/W

20-QFN

41

°C/W

Thermal Resistance

Junction to Board

JB

Junction to Board2

10-MSOP

84

°C/W

16-QFN

48

°C/W

20-QFN

16

°C/W

ΨJB

Still Air1

10-MSOP

83

°C/W

16-QFN

31

°C/W

20-QFN

8.1

°C/W

Thermal Resistance

Junction to Top Center

ΨJT

Still Air1

10-MSOP

0.74

°C/W

16-QFN

3.8

°C/W

20-QFN

0.98

°C/W

Notes:

1. Based on environment and board designed per JESD51-2A, JESD51-5, and JESD51-7.

2. Based on conditions set in JESD51-8.

Table 12. Thermal Characteristics (Junction-to-Case)

Parameter

Symbol

Test Condition

Package

Value

Unit

Thermal Resistance

Junction to Case1

JC

Still Air

10-MSOP

36

°C/W

16-QFN

82

°C/W

20-QFN

51

°C/W

Notes:

1. Based on board designed per JESD51-1 (Top center of packages used).