PA1

ANTENNA

RFIN1

LMV232

RF

INPUT

OUT

R1

6.2 k:

RFIN2

PA2

RF

INPUT

FB

BS

SD

VDD

GND

A3

B3

C1

B1

A1

C3

C2

A2

R3

50:

C1

1.5 nF

COUPLER

COUPLER

TO BASEBAND

R2

50:

LMV232

www.ti.com

SNWS017C – DECEMBER 2004 – REVISED MARCH 2013

LMV232 Dual-Channel Integrated Mean Square Power Detector for CDMA & WCDMA

Check for Samples: LMV232

1

FEATURES

DESCRIPTION

The LMV232 dual RF detector is designed for RF

•

>20 dB Square-Law Detection Range

transmit power measurement in mobile phones. This

•

2 Sequentially Selectable RF Inputs

dual mean square IC is especially suited for accurate

•

Low Power Consumption Shutdown Mode

power measurement of RF signals exhibiting high

peak-to-average ratios used in 3G and UMTS/CDMA

•

Externally Configurable Gain and LF Filter

applications. The LMV232 saves calibration steps

Bandwidth.

and system certification and is highly accurate. The

•

Internal 50

Ω RF Termination Impedance

circuit operates with a single supply from 2.5 to 3.3V.

•

Optimized for Use with 20 dB Directional

The LMV232 contains a mean square detector with

Coupler

two sequentially selectable RF inputs. The RF input

•

Lead Free 8-Bump DSBGA Package 1.5 x 1.5 x

power range of the device has been optimized for use

0.6 mm

with a 20 dB directional coupler, without the need for

additional external components. A single external RC

combination between FB and OUT provides an

APPLICATIONS

externally configurable gain and LF filter bandwidth of

•

3G Mobile Communications

the device.

•

UMTS

The device has two digital interfaces. A shutdown

•

WCDMA

function is available to set the device in a low-power

•

CDMA2000

shutdown mode. In case SD = HIGH, the device is in

shutdown, if SD = LOW the device is active. The

•

TD-SCDMA

Band-Select function controls the selection of the

•

RF Control

active RF input channel. In case BS = HIGH, RFIN1 is

•

Wireless LAN

active. In case BS = LOW, RFIN2 is active.

•

PC Card and GPS Modules

The dual mean square detector is offered in an 8-

bump DSBGA 1.5 x 1.5 x 0.6 mm package. This

DSBGA package has the smallest footprint and

height.

TYPICAL APPLICATION

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2004–2013, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.