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VN770KP Datasheet(PDF) 25 Page - STMicroelectronics |
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VN770KP Datasheet(HTML) 25 Page - STMicroelectronics |
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25 / 33 page ![]() DocID022021 Rev 4 25/33 VN770KP-E Thermal data 32 4 Thermal data 4.1 SO-28 thermal data Figure 47. SO-28 PC board Note: Layout condition of Rth and Zth measurements (PCB FR4 area = 58 mm x 58 mm, PCB thickness = 2mm, Cu thickness = 35 μm, Copper areas: from minimum pad layout to 6 cm2). Figure 48. Chipset configuration Figure 49. Auto and mutual Rthj-amb vs PCB copper area in open box free air condition Note: See definitions in Section 5.2 on page 31. |
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