Package mechanical data

L2293Q

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Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com

Note:

1

VFQFPN stands for thermally enhanced very thin profile fine pitch Quad Flat Package No

lead. Very thin profile: 0.80 < A

≤ 1.00 mm.

2

Details of terminal 1 are optional but must be located on the top surface of the package by

using either a mold or marked features.

Table 8.

VFQFPN 5x5x1.0 32L pitch 0.50

Dim.

Databook (mm)

Min

Typ

Max

A

0.80

0.85

0.95

b

0.18

0.25

0.30

b1

0.165

0.175

0.185

D

4.85

5.00

5.15

D2

3.00

3.10

3.20

D3

1.10

1.20

1.30

E

4.85

5.00

5.15

E2

4.20

4.30

4.40

E3

0.60

0.70

0.80

e0.50

L

0.30

0.40

0.50

ddd

0.08