PCF2123_09 datasheet(2/55 Pages) NXP

2 / 55 page

PCF2123_2

Product data sheet

Rev. 02 — 4 December 2009

2 of 55

NXP Semiconductors

PCF2123

SPI Real time clock/calendar

Ordering information

[1]

Sawn wafer on Film Frame Carrier (FFC).

[2]

Sawn wafer with gold bumps on Film Frame Carrier (FFC).

Marking

Table 1.

Ordering information

Type number

Package

Name

Description

Version

PCF2123TS

TSSOP14

plastic thin shrink small outline package;

14 leads; body width 4.4 mm

SOT402-1

PCF2123BS

HVQFN16

plastic thermal enhanced very thin quad ﬂat

package; no leads; 16 terminals;

body 3

× 3 × 0.85 mm

SOT758-1

PCF2123U/10AA PCF2123U/10 wire bond die; 12 bonding pads;

1.492

× 1.449 × 0.20 mm[1]

PCF2123U/10

PCF2123U/12AA PCF2123U/12 WLCSP12; wafer level chip size package;

12 bumps; 1.492

× 1.449 × 0.22 mm[2]

PCF2123U/12

Table 2.

Marking codes

Type number

Marking code

PCF2123TS

PCF2123

PCF2123BS

123

PCF2123U/10AA

PC2123-1

PCF2123U/12AA

PC2123-1

PCF2123 Datasheet(PDF) 2 Page - NXP Semiconductors

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