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K6R1016C1D Datasheet(PDF) 7 Page - Samsung semiconductor

Part # K6R1016C1D
Description  64Kx16 Bit High-Speed CMOS Static RAM(3.3V Operating) Operated at Commercial and Industrial Temperature Ranges.
PDF  11 Pages
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

K6R1016C1D Datasheet(HTML) 7 Page - Samsung semiconductor

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K6R1016V1D
CMOS SRAM
Revision 3.0
- 7 -
June 2002
for AT&T
NOTES(READ CYCLE)
1. WE is high for read cycle.
2. All read cycle timing is referenced from the last valid address to the first transition address.
3. tHZ and tOHZ are defined as the time at which the outputs achieve the open circuit condition and are not referenced to VOH or
VOL levels.
4. At any given temperature and voltage condition, tHZ(Max.) is less than tLZ(Min.) both for a given device and from device to
device.
5. Transition is measured
±200mV from steady state voltage with Load(B). This parameter is sampled and not 100% tested.
6. Device is continuously selected with CS=VIL.
7. For common I/O applications, minimization or elimination of bus contention conditions is necessary during read and write cycle.
TIMING WAVEFORM OF READ CYCLE(2) (WE=VIH)
TIMING WAVEFORM OF WRITE CYCLE(1) (OE =Clock)
Address
CS
UB, LB
WE
Data in
Data out
tWC
tCW(3)
tBW
tWP(2)
tAS(4)
tDH
tDW
tOHZ(6)
High-Z
High-Z
Valid Data
OE
tAW
tWR(5)
Valid Data
High-Z
tRC
CS
Address
UB, LB
OE
Data out
tHZ(3,4,5)
tAA
tCO
tBA
tOE
tOLZ
tLZ(4,5)
tOHZ
tBHZ(3,4,5)
tBLZ(4,5)
tPU
tPD
50%
50%
VCC
Current
ICC
ISB
tDH



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