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MPC5604B Datasheet(PDF) 32 Page - Freescale Semiconductor, Inc |
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MPC5604B Datasheet(HTML) 32 Page - Freescale Semiconductor, Inc |
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32 / 106 page ![]() 4 Electrical characteristics 4.1 Introduction This section contains electrical characteristics of the device as well as temperature and power considerations. This product contains devices to protect the inputs against damage due to high static voltages. However, it is advisable to take precautions to avoid application of any voltage higher than the specified maximum rated voltages. To enhance reliability, unused inputs can be driven to an appropriate logic voltage level (VDD or VSS). This could be done by the internal pull-up and pull-down, which is provided by the product for most general purpose pins. The parameters listed in the following tables represent the characteristics of the device and its demands on the system. In the tables where the device logic provides signals with their respective timing characteristics, the symbol “CC” for Controller Characteristics is included in the Symbol column. In the tables where the external system must provide signals with their respective timing characteristics to the device, the symbol “SR” for System Requirement is included in the Symbol column. CAUTION All 64 LQFPinformation is indicative and must be confirmed during silicon validation. 8 This pad is used on MPC5607B 100-pin and 144-pinto provide supply for the second ADC. Therefore it is recommended not using it to keep the compatibility with the family devices. 9 Out of reset all the functional pins except PC[0:1] and PH[9:10] are available to the user as GPIO. PC[0:1] are available as JTAG pins (TDI and TDO respectively). PH[9:10] are available as JTAG pins (TCK and TMS respectively). It is up to the user to configure these pins as GPIO when needed, in this case MPC5604B/C get incompliance with IEEE 1149.1-2001. 10 The TDO pad has been moved into the STANDBY domain in order to allow low-power debug handshaking in STANDBY mode. However, no pull-resistor is active on the TDO pad while in STANDBY mode. At this time the pad is configured as an input. When no debugger is connected the TDO pad is floating causing additional current consumption. To avoid the extra consumption TDO must be connected. An external pull-up resistor in the range of 47–100 kOhms should be added between the TDO pin and VDD. Only in case the TDO pin is used as application pin and a pull-up cannot be used then a pull-down resistor with the same value should be used between TDO pin and GND instead. 11 Available only on MPC560xC versions and MPC5604B 208 MAPBGA devices 12 Not available on MPC5602B devices 13 Not available in 100 LQFP package 14 Available only on MPC5604B 208 MAPBGA devices 15 Not available on MPC5603B 144-pin devices |
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