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SSD02N65 Datasheet(PDF) 2 Page - SeCoS Halbleitertechnologie GmbH |
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SSD02N65 Datasheet(HTML) 2 Page - SeCoS Halbleitertechnologie GmbH |
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2 / 4 page ![]() SSD02N65 2A , 650V , RDS(ON) 8 N-Ch Enhancement Mode Power MOSFET Elektronische Bauelemente 24-Nov-2011 Rev. A Page 2 of 4 http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually. ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Parameter Symbol Min. Typ. Max. Unit Teat Conditions Static Drain-Source Breakdown Voltage BVDSS 650 - - V VGS=0, ID= 250µA Breakdown Voltage Temperature Coefficient △BVDSS /△TJ - 0.37 - V/°C Reference to 25°C, ID=1mA Gate-Threshold Voltage VGS(th) 2 - 5 V VDS=VGS, ID=250µA Forward Transconductance gfs - 1.7 - S VDS=10V, ID=1.0A Gate-Source Leakage Current IGSS - - ±100 nA VGS= ±30V Drain-Source Leakage Current IDSS - - 2 µA VDS=520V, VGS=0 Static Drain-Source On-Resistance 2 RDS(ON) - 6.3 8 VGS=10V, ID=1A Total Gate Charge Qg - 8 - nC ID=1A VDS=520V VGS=10V Gate-Source Charge Qgs - 2.56 - Gate-Drain (“Miller”) Change Qgd - 2.67 - Turn-on Delay Time 3 Td(on) - 4.8 - nS VDD=300V ID=1A VGS=10V RG=10 Rise Time Tr - 18.4 - Turn-off Delay Time Td(off) - 10.8 - Fall Time Tf - 23.2 - Input Capacitance Ciss - 290 - pF VGS =0 VDS=25 V f =1.0MHz Output Capacitance Coss - 25 - Reverse Transfer Capacitance Crss - 4 - Guaranteed Avalanche Characteristics Single Pulse Avalanche Energy 5 EAS 3.2 - - mJ VDD=50V,L=1mH , IAS=1.5A Source-Drain Diode Diode Forward Voltage 2 VSD - - 1 V IS=1A, VGS=0, Tj=25°C, Continuous Source Current 1,6 IS - - 2 A VD=VG=0, VS =1V Pulsed Source Current 2,6 ISM - - 4 A Notes: 1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper. 2. The data tested by pulsed , pulse width ≦ 300µs , duty cycle ≦ 2% 3. The EAS data shows Max. rating . The test condition is VDD=50V,VGS=10V,L=1mH,IAS=1.5A 4. The power dissipation is limited by 150°C, junction temperature 5. The Min. value is 100% EAS tested guarantee. 6. The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation. |
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