MPC5744P datasheet(65/114 Pages) FREESCALE

65 / 114 page

Electrical characteristics

MPC5744P Data Sheet, Rev. 0.3

Preliminary—Subject to Change Without Notice

Freescale Semiconductor

3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification

for the specified package.

4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is

used for the case temperature. Reported value includes the thermal resistance of the interface layer.

5 Thermal characterization parameter indicating the temperature difference between the package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written

as Psi-JT.

Table 13. Thermal characteristics for 176 LQFP-EP package1

Symbol

Parameter

Conditions

Value Unit

RθJA

Thermal resistance, junction-to-ambient natural

convection2

Single layer board – 1s

°C/W

Four layer board – 2s2p

RθJMA

Thermal resistance, junction-to-ambient forced

convection at 200 ft/min

Single layer board – 1s

°C/W

Four layer board – 2s2p

RθJB

Thermal resistance junction-to-board3

—12

°C/W

RθJC

Thermal resistance junction-to-case top4

—10

°C/W

ΨJT

Junction-to-package-top natural convection5

—3

°C/W

NOTES:

1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.

2 Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board

meets JEDEC specification for this package.

3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC

specification for the specified package.

4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate

temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.

5 Thermal characterization parameter indicating the temperature difference between the package top and the

junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization

parameter is written as Psi-JT.

Table 14. Thermal characteristics for 257 MAPBGA package1

NOTES:

1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.

Symbol

Parameter

Conditions

Value Unit

RθJA

Thermal resistance junction-to-ambient natural

convection2

2 Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board

meets JEDEC specification for this package.

Single layer board – 1s

°C/W

Four layer board – 2s2p

RθJMA

Thermal resistance, junction-to-ambient forced

convection at 200 ft/min

Single layer board – 1s

°C/W

Four layer board – 2s2p

RθJB

Thermal resistance junction-to-board3

3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC

specification for the specified package.

—13

°C/W

RθJC

Thermal resistance junction-to-case4

—8

°C/W

ΨJT

Junction-to-package-top natural convection5

—2

°C/W

MPC5744P Datasheet(PDF) 65 Page - Freescale Semiconductor, Inc

MPC5744P Datasheet(HTML) 65 Page - Freescale Semiconductor, Inc

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL