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AS5130

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 6 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

Supply Voltage

0.3

7

V

Only relevant for polling operation mode, supply

voltage with capacitor of the integrated storage register

Input Pin Voltage

VDD

V

Input Current (latchup immunity)

-100

100

mA

Norm: EIA/JESD78 ClassII Level A

Electrostatic Discharge

±2

kV

Norm: JESD22-A114E

Package Thermal Resistance SSOP-16

133

168

K/W

Still Air / Single Layer PCB

Storage Temperature

-55

150

ºC

Ambient Temperature

-40

125

ºC

Junction Temperature

150

ºC

Package body temperature

260

ºC

Norm: IPC/JEDEC J-STD-020.

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020 “Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid State Surface

Mount Devices”.

The lead finish for Pb-free leaded packages is matte tin

(100% Sn).

Humidity non-condensing

5

85

%

Moisture Sensitivity Level (MSL)

3

Represents a maximum floor life time of 168h