RF Micro Devices Inc.

7628 Thorndike Road, Greensboro, NC 27409-9421

DS140527

For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com.

The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of

third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended

application circuitry and specifications at any time without prior notice.

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RF5365

PCB Recommendations

PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown has been developed

and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate lead and package tolerances. Since

surface mount processes vary from company to company, careful process development is recommended.

Thermal vias for center slug “B” should be incorporated into the PCB design. The number and size of thermal vias will depend on the application.

Example of the number and size of vias can be found on the RFMD evaluation board layout.