13

DS787PP9

5.4 Power Supply Characteristics

5.4 Power Supply Characteristics

Note:

Measurements performed under operating conditions

1. Dependent on application firmware and DSP clock speed.

5.5 Thermal Data (100-pin LQFP with Exposed Pad)

1. To calculate the die temperature for a given power dissipation:

2. To calculate the case temperature for a given power dissipation:

Note:

Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20%

of the top and bottom layers.

Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20% of the

top and bottom layers and 0.5-oz. copper covering 90% of the internal power plane and ground plane layers.

5.6 Digital Switching Characteristics–RESET

1. The rising edge of RESET must not occur before the power supplies are stable at the recommended operating values as described in Section 5.2. In

Parameter

Min Typ Max Unit

Operational Power Supply Current:

VDDA: PLL operating current

VDDA: DAC operating current (all 8 channels enabled)

VDDA: ADC operating current (all 4 channels enabled)

VDDIO: With most ports operating

Total Operational Power Dissipation:

Standby Power Supply Current:

VDD: Core and I/O not clocked

VDDA: PLLs halted

VDDA: DAC disabled

VDDA: ADC disabled

VDDIO: All connected I/O pins 3-stated by other ICs in system

Total Standby Power Dissipation:

—

—

—

—

—

—

—

—

—

—

325

16

56

34

27

1025

410

26

40

24

215

1745

—

—

—

—

—

—

—

—

—

—

mA

mA

mA

mA

mA

mW

μA

μA

μA

μA

μA

μW

Parameter

Symbol Min

Typ

Max

Unit

Thermal Resistance (Junction to Ambient)



ja

—

—

34

18

—

—

°C/Watt

Thermal Resistance (Junction to Top of Package)



jt

—

—

0.54

.28

—

—

°C/Watt

Parameter

Symbol Min Max Unit

1—

All bidirectional pins high-Z after RESET low

—

200

ns

Configuration pins setup before RESET high

50

—

ns

Configuration pins hold after RESET high

20

—

ns