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MCP2003B Datasheet(PDF) 9 Page - Microchip Technology |
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MCP2003B Datasheet(HTML) 9 Page - Microchip Technology |
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9 / 32 page ![]() 2015-2016 Microchip Technology Inc. DS20005463C-page 9 MCP2003B 2.0 ELECTRICAL CHARACTERISTICS 2.1 Absolute Maximum Ratings† VIN DC Voltage on RXD, TXD, CS ...................................................................................................................-0.3 to +50V VIN DC Voltage on WAKE and VREN ..............................................................................................................-0.3 to +VBB VBB Battery Voltage, continuous, non-operating(1) ........................................................................................-0.3 to +50V VBB Battery Voltage, non-operating (LIN bus recessive)(2)............................................................................-0.3 to +60V VBB Battery Voltage, transient ISO 7637 Test 1 ......................................................................................................-200V VBB Battery Voltage, transient ISO 7637 Test 2a ...................................................................................................+150V VBB Battery Voltage, transient ISO 7637 Test 3a ....................................................................................................-300V VBB Battery Voltage, transient ISO 7637 Test 3b ...................................................................................................+200V VLBUS Bus Voltage, continuous.......................................................................................................................-18 to +50V VLBUS Bus Voltage, transient(3).......................................................................................................................-27 to +60V VLBUS Bus Voltage, Direct Capacitor Coupling without TVS (SAE J2962-1) ........................................... ±35V and ±85V ILBUS Bus Short-Circuit Current Limit....................................................................................................................200 mA ESD protection on LIN, without TVS (SAE J2962-1) ............................................................................................. ±25 kV ESD protection on LIN, VBB, WAKE (IEC 61000-4-2)(4) .......................................................................................... ±6 kV ESD protection on LIN, VBB, WAKE, CS (Human Body Model)(5) ........................................................................... ±8 kV ESD protection on all other pins (Human Body Model)(5) ........................................................................................ ±4 kV ESD protection on all pins (Charge Device Model)(6) .............................................................................................. ±2 kV ESD protection on all pins (Machine Model)(7) .......................................................................................................±400V Maximum Junction Temperature........................................................................................................................... +150 C Storage Temperature ..................................................................................................................................-65 to +150 C Note 1: LIN 2.x compliant specification. 2: SAE J2602 compliant specification. 3: ISO 7637/1 load dump compliant (t < 500 ms). 4: According to IEC 61000-4-2, 330 , 150 pF and Transceiver EMC Test Specifications [2] to [4]. For WAKE pin to meet the specification, series resistor must be in place (refer to Example 1-2). 5: According to AEC-Q100-002/JESD22-A114. 6: According to AEC-Q100-011B. 7: According to AEC-Q100-003/JESD22-A115. † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device, at those or any other conditions above those indicated in the operational listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. |
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