MCP2003B datasheet(14/32 Pages) MICROCHIP

Part #	MCP2003B

Description	LIN Transceiver

PDF	32 Pages

Scroll/Zoom	100%

Manufacturer	MICROCHIP [Microchip Technology]

Direct Link	http://www.microchip.com

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14 / 32 page

MCP2003B

DS20005463C-page 14

 2015-2016 Microchip Technology Inc.

2.5

Thermal Specifications

Parameter

Symbol

Typ.

Max.

Units

Test Conditions

Recovery Temperature

RECOVERY

+160

—

C

Shutdown Temperature

SHUTDOWN

+180

—

C

Short-Circuit Recovery Time

tTHERM

1.5

5.0

Thermal Package Resistances

Thermal Resistance, 2x3 8L-DFN

JA

—

C/W

Thermal Resistance, 3x3 8L-DFN

JA

56.7

—

C/W

Thermal Resistance, 8L-SOIC

JA

149.5

—

C/W

Note 1:

The maximum power dissipation is a function of TJMAX,

JA and ambient temperature TA. The maximum

allowable power dissipation at an ambient temperature is PD = (TJMAX - TA)

JA. If this dissipation is

exceeded, the die temperature will rise above 150

C and the device will go into thermal shutdown.

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