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MCP2003B Datasheet(PDF) 1 Page - Microchip Technology

Part # MCP2003B
Description  LIN Transceiver
PDF  32 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP2003B Datasheet(HTML) 1 Page - Microchip Technology

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 2015-2016 Microchip Technology Inc.
DS20005463C-page 1
MCP2003B
Features
• The MCP2003B is Compliant with Local
Interconnect Network (LIN) Bus Specifications
1.3, 2.0, 2.1, 2.2, SAE J2602, and ISO17987
• Supports Baud Rates up to 20 Kbaud
with
LIN-Compatible Output Driver
• 60V Load Dump Protected
• Very High Electromagnetic Immunity (EMI) Meets
Stringent Original Equipment Manufacturers
(OEM) Requirements
• Direct Capacitor Coupling Robustness without
Transient Voltage Suppressor (TVS):
- ±35V on LBUS (SAE J2962-1)
- ±85V on LBUS (SAE J2962-1)
• High Electrostatic Discharge (ESD)
Immunity without TVS:
->25 kV on LBUS (SAE J2962-1)
->15 kV on VBB (IEC 61000-4-2)
- >6 kV on LBUS (IEC 61000-4-2)
• Very High Immunity to RF Disturbances Meets
Stringent OEM Requirements
• Wide Supply Voltage: 5.5V – 30.0V Continuous
• Extended (E) Temperature Range: -40°C to +125°C
• High (H) Temperature Range: -40°C to +150°C
• Interfaces to PIC® MCU EUSART and Standard
USARTs
• LIN Bus Pin:
- Internal pull-up resistor and diode
- Protected against battery shorts
- Protected against loss of ground
- High current drive: >40 mA
• Automatic Thermal Shutdown
• Low-Power Mode:
- Receiver monitoring bus and transmitter off:
(
5µA)
Description
This device provides a bidirectional, half-duplex
communication, physical interface to automotive and
industrial LIN systems to meet the LIN Bus
Specification Revision 2.2, SAE J2602, and ISO
17987.
The
device
is
both
short-circuit
and
overtemperature protected by internal circuitry. The
device has been specifically designed to operate in the
automotive operating environment and will survive all
specified transient conditions while meeting all of the
stringent quiescent current requirements.
Package Types
MCP2003B
SOIC
MCP2003B
2x3 DFN*
* Includes Exposed Thermal Pad (EP); see Table 1-2.
WAKE
CS
TXD
VBB
LBUS
1
2
3
4
8
7
6
5 VSS
VREN
RXD
EP
9
WAKE
CS
TXD
VBB
LBUS
1
2
3
4
8
7
6
5 VSS
VREN
RXD
EP
9
MCP2003B
3x3 DFN*
WAKE
CS
TXD
VBB
LBUS
1
2
3
4
8
7
6
5 VSS
VREN
RXD
LIN Transceiver


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