Preliminary Technical Data

ADT7301

Rev. PrJ | Page 5 of 14

ABSOLUTE MAXIMUM RATINGS

Table 3. ADT7301 Stress Ratings

Parameter

Rating

−0.3 V to +7 V

Digital Input Voltage to GND

Digital Output Voltage to GND

−40°C to +150°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature

+150°C

6-Lead SOT-23 (RJ-6)

Thermal Impedance

190.4°C/W

8-Lead MSOP (RM-8)

205.9°C/W

43.74°C/W

IR Reflow Soldering

Peak Temperature

+220°C (−0/+5°C)

Time at Peak Temperature

10 s to 20 s

Ramp-up Rate

2°C/s to 3°C/s

Ramp-down Rate

−6°C/sec

for greater than a total of 5% of the lifetime of the device. Any exposure

beyond this limit will affect device reliability.

Figure 3 for a plot of maximum power dissipation versus ambient

preferential flow direction, e.g., components mounted on a heat sink.

Junction-to-ambient resistance is more useful for air-cooled, PCB mounted

components.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability

0

0.2

0.6

0.4

0.8

1.0

1.2

TEMPERATURE (°C)

SOT-23

MSOP

Figure 3. Plot of Maximum Power Dissipation vs. Temperature

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.