 2015 Microchip Technology Inc.

DS20005045C-page 25

SST25VF080B

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Microchip Technology Drawing C04-14008A Sheet 1 of 1

8-Lead Very, Very Thin Small Outline No-Leads (QAE/F) - 5x6 mm Body [WSON]

Note:

1.

All linear dimensions are in millimeters (max/min).

2.

Untoleranced dimensions (shown with box surround)

are nominal target dimensions.

3.

The external paddle is electrically connected to the

die back-side and possibly to certain VSS leads.

This paddle can be soldered to the PC board;

it is suggested to connect this paddle to the VSS of the unit.

Connection of this paddle to any other voltage potential can

result in shorts and/or electrical malfunction of the device.