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STM32F038X6 Datasheet(PDF) 61 Page - STMicroelectronics |
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STM32F038X6 Datasheet(HTML) 61 Page - STMicroelectronics |
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61 / 102 page ![]() DocID026079 Rev 5 61/102 STM32F038x6 Electrical characteristics 79 Software recommendations The software flowchart must include the management of runaway conditions such as: • Corrupted program counter • Unexpected reset • Critical Data corruption (for example control registers) Prequalification trials Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1 second. To complete these trials, ESD stress can be applied directly on the device, over the range of specification values. When unexpected behavior is detected, the software can be hardened to prevent unrecoverable errors occurring (see application note AN1015). Electromagnetic Interference (EMI) The electromagnetic field emitted by the device are monitored while a simple application is executed (toggling 2 LEDs through the I/O ports). This emission test is compliant with IEC 61967-2 standard which specifies the test board and the pin loading. 6.3.11 Electrical sensitivity characteristics Based on three different tests (ESD, LU) using specific measurement methods, the device is stressed in order to determine its performance in terms of electrical sensitivity. Electrostatic discharge (ESD) Electrostatic discharges (a positive then a negative pulse separated by 1 second) are applied to the pins of each sample according to each pin combination. The sample size depends on the number of supply pins in the device (3 parts × (n+1) supply pins). This test conforms to the JESD22-A114/C101 standard. Table 40. EMI characteristics Symbol Parameter Conditions Monitored frequency band Max vs. [fHSE/fHCLK] Unit 8/48 MHz SEMI Peak level VDD = 1.8 V, TA = 25 °C, LQFP48 package compliant with IEC 61967-2 0.1 to 30 MHz -1 dBµV 30 to 130 MHz 21 130 MHz to 1 GHz 27 EMI Level 4 - |
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