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STM32F038X6 Datasheet(PDF) 41 Page - STMicroelectronics

Part # STM32F038X6
Description  Clock management
PDF  102 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F038X6 Datasheet(HTML) 41 Page - STMicroelectronics

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STM32F038x6
Electrical characteristics
79
6.3
Operating conditions
6.3.1
General operating conditions
6.3.2
Operating conditions at power-up / power-down
The parameters given in Table 19 are derived from tests performed under the ambient
temperature condition summarized in Table 18.
Table 18. General operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
fHCLK
Internal AHB clock frequency
-
0
48
MHz
fPCLK
Internal APB clock frequency
-
0
48
VDD
Standard operating voltage
-
1.65
1.95
V
VDDA
Analog operating voltage
(ADC not used)
Must have a potential equal
to or higher than VDD
VDD
3.6
V
Analog operating voltage
(ADC used)
2.4
3.6
VBAT
Backup operating voltage
-
1.65
3.6
V
VIN
I/O input voltage
TC and RST I/O
–0.3
VDDIOx+0.3
V
TTa and POR I/O
–0.3
VDDA+0.3(1)
FT and FTf I/O
–0.3
5.2(1)
BOOT0
0
5.2
PD
Power dissipation at TA = 85 °C
for suffix 6 or TA = 105 °C for
suffix 7(2)
LQFP48
-
364
mW
UFQFPN32
-
526
UFQFPN28
-
169
WLCSP25
-
267
TSSOP20
-
182
TA
Ambient temperature for the
suffix 6 version
Maximum power dissipation
–40
85
°C
Low power dissipation(3)
–40
105
Ambient temperature for the
suffix 7 version
Maximum power dissipation
–40
105
°C
Low power dissipation(3)
–40
125
TJ
Junction temperature range
Suffix 6 version
–40
105
°C
Suffix 7 version
–40
125
1. For operation with a voltage higher than VDDIOx + 0.3 V, the internal pull-up resistor must be disabled.
2. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax. See Section 7.6: Thermal characteristics.
3. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see Section 7.6:
Thermal characteristics).



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