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M95M01-DF Datasheet(PDF) 50 Page - STMicroelectronics |
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M95M01-DF Datasheet(HTML) 50 Page - STMicroelectronics |
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50 / 51 page ![]() Revision history M95M01-DF M95M01-R 50/51 DocID13264 Rev 14 30-Jun-2016 13 Updated Figure 8: Write Enable (WREN) sequence and Figure 9: Write Disable (WRDI) sequence. Updated footnote 1 of Table 7: Absolute maximum ratings. Updated caption of Figure 25: TSSOP8 – 8-lead thin shrink small outline, 3 x 4.4 mm, 0.65 mm pitch, package outline and of Table 17: TSSOP8 – 8-lead thin shrink small outline, 3 x 4.4 mm, 0.65 mm pitch, package mechanical data. Updated Section 10.8: WLCSP package information. Updated Table 31: Ordering information scheme. 21-Feb-2017 14 Updated: – Features – Package information Added: – Table 21: Ordering information scheme (unsawn wafer) Table 22. Document revision history (continued) Date Revision Changes |
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