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MPXM2102AS Datasheet(PDF) 563 Page - Motorola, Inc

Part # MPXM2102AS
Description  Sensor
PDF  670 Pages
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Manufacturer  MOTOROLA [Motorola, Inc]
Direct Link  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

MPXM2102AS Datasheet(HTML) 563 Page - Motorola, Inc

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AN4007
3–417
Motorola Sensor Device Data
www.motorola.com/semiconductors
SENSOR PACKAGING
The packaging of a pressure sensor die is critical to achieve
optimal performances of the final product. The package must
isolate the pressure sensor die from unwanted external stress
which can cause undesired drift of the electrical signal while
being robust enough to support the pressure applied to the
device without cracks, leaks or mechanical failures. It must be
media compatible for the same reasons.
Figure 7. Mounting Suggestion
CUSTOMER
FLAT RING
APPLIED PRESSURE
(OR VACUUM)
PRESSURE PORT
APPLICATION
HOUSING
SCREW
SNAP–FIT
PRINTED CIRCUIT BOARD
SOP PACKAGE
CASE 482
The new small pressure sensor package from Motorola
addresses those requirements and lets designers mount a
pressure sensor directly on a printed circuit board, thus
providing great flexibility for space saving design. Figure 7
shows a typical assembly using a small outline package
(SOP) Case 482–01.
The sensor can be mounted on the printed circuit board by
an automatic pick and place machine as with every other
surface mount component. Sealing is done by using a silicone
flat ring inserted in the application housing. The printed circuit
board must be maintained against the flat ring either by a snap
fit, or by a screws as shown.
The new small outline package (SOP) is fabricated using
poly–phenyl sulfide (PPS), a robust material, which can
withstand high temperatures and is highly resistant to
chemicals.
Consequently, the package is ideal for harsh
environment such as automotive, industrial or medical
systems.
The small outline package is suitable for any of Motorola’s
sensor chips from the basic uncompensated sensor to the
fully integrated sensing solution that include amplifiers and
other circuitry all on one chip.
Motorola’s sensors using this package are available in both
tubes and tape and reel configuration for high productivity on
your assembly line.
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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