MPC9331 datasheet(11/12 Pages) MOTOROLA

11 / 12 page

Advanced Clock Drivers Devices

Freescale Semiconductor

MPC9331

PACKAGE DIMENSIONS

12 REF

DIM

MIN

MAX

MILLIMETERS

7.00 BSC

0.80 BSC

9.00 BSC

0.30

0.40

0.09

0.20

0.09

0.16

1.00 REF

0.08

0.20

1.40

1.60

0.05

0.15

1.35

1.45

0.30

0.45

0.08

---

0˚

7˚

9.00 BSC

7.00 BSC

0.50

0.70

0.20 REF

D/2

D1/2

E1/2

E/2

A-B

0.20 H

A-B

0.20 C

DETAIL G

PIN 1 INDEX

DETAIL AD

R R2

θ˚

(S)

(L1)

0.25

GAUGE PLANE

(

θ1˚)

R R1

SEATING

PLANE

DETAIL AD

0.1 C

32X

28X

DETAIL G

e/2

A, B, D

SECTION F-F

BASE

METAL

A-B

0.20

PLATING

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

3. DATUMS A, B, AND D TO BE DETERMINED AT

DATUM PLANE H.

4. DIMENSIONS D AND E TO BE DETERMINED AT

SEATING PLANE C.

5. DIMENSION b DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED

THE MAXIMUM b DIMENSION BY MORE THAN

0.08-mm. DAMBAR CANNOT BE LOCATED ON THE

LOWER RADIUS OR THE FOOT. MINIMUM SPACE

BETWEEN PROTRUSION AND ADJACENT LEAD OR

PROTRUSION: 0.07-mm.

6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS

0.25-mm PER SIDE. D1 AND E1 ARE MAXIMUM

PLASTIC BODY SIZE DIMENSIONS INCLUDING

MOLD MISMATCH.

7. EXACT SHAPE OF EACH CORNER IS OPTIONAL.

8. THESE DIMENSIONS APPLY TO THE FLAT

SECTION OF THE LEAD BETWEEN 0.1-mm AND

0.25-mm FROM THE LEAD TIP.

CASE 873A-03

ISSUE B

32-LEAD LQFP PACKAGE

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