CC3235MODASF datasheet(6/100 Pages) TI1

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CC3235MODAS, CC3235MODASF

SWRS233 – OCTOBER 2019

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Table of Contents

Module Overview

........................................ 1

1.1

Features

.............................................. 1

1.2

Applications

........................................... 2

1.3

Description

............................................ 2

1.4

Functional Block Diagrams

........................... 3

Revision History

......................................... 7

Device Comparison

..................................... 8

3.1

Related Products

.................................... 10

Terminal Configuration and Functions

............ 11

4.1

CC3235MODAx Pin Diagram

....................... 11

4.2

Pin Attributes and Pin Multiplexing

.................. 12

4.3

Signal Descriptions

.................................. 29

4.4

Drive Strength and Reset States for Analog-Digital

Multiplexed Pins

..................................... 34

4.5

Pad State After Application of Power to Chip, but

Before Reset Release

............................... 34

4.6

Connections for Unused Pins

....................... 35

Specifications

........................................... 36

5.1

Absolute Maximum Ratings

......................... 36

5.2

ESD Ratings

........................................ 36

5.3

Recommended Operating Conditions

............... 36

5.4

Current Consumption (CC3235MODAS)

........... 37

5.5

Current Consumption (CC3235MODASF)

.......... 39

5.6

TX Power Control for 2.4 GHz Band

................ 41

5.7

TX Power Control for 5 GHz

........................ 43

5.8

Brownout and Blackout Conditions

................. 43

5.9

Electrical Characteristics for GPIO Pins

............ 45

5.10

GPIO Pins Except 25, 26, 42, and 44 (25°C)

....... 45

5.11

GPIO Pins 25, 26, 42, and 44 (25°C)

............... 46

5.12

Pin Internal Pullup and Pulldown (25°C)

............ 46

5.13

CC3235MODAx Antenna Characteristics

........... 47

5.14

WLAN Receiver Characteristics

.................... 48

5.15

WLAN Transmitter Characteristics

.................. 49

5.16

BLE and WLAN Coexistence Requirements

........ 50

5.17

Reset Requirement

................................. 50

5.18

Thermal Resistance Characteristics for MOB and

MON Packages

..................................... 50

5.19

Timing and Switching Characteristics

............... 51

Detailed Description

................................... 63

6.1

Overview

............................................ 63

6.2

Functional Block Diagram

........................... 63

6.3

Arm® Cortex®-M4 Processor Core Subsystem

..... 64

6.4

Wi-Fi® Network Processor Subsystem

.............. 65

6.5

Security

.............................................. 67

6.6

FIPS 140-2 Level 1 Certification

.................... 70

6.7

Power-Management Subsystem

.................... 70

6.8

Low-Power Operating Mode

........................ 70

6.9

Memory

.............................................. 72

6.10

Restoring Factory Default Configuration

............ 74

6.11

Boot Modes

.......................................... 74

6.12

Hostless Mode

...................................... 75

6.13

Device Certification and Qualification

............... 76

6.14

SRRC Certification and Statement

.................. 76

6.15

Module Markings

.................................... 77

6.16

End Product Labeling

............................... 78

6.17

Manual Information to the End User

................ 78

Applications, Implementation, and Layout

....... 78

7.1

Typical Application

.................................. 78

7.2

Device Connection and Layout Fundamentals

...... 81

7.3

PCB Layout Guidelines

............................. 81

Environmental Requirements and SMT

Specifications

........................................... 83

8.1

PCB Bending

........................................ 83

8.2

Handling Environment

.............................. 83

8.3

Storage Condition

................................... 83

8.4

PCB Assembly Guide

............................... 83

8.5

Baking Conditions

................................... 84

8.6

Soldering and Reflow Condition

.................... 85

Device and Documentation Support

............... 86

9.1

Third-Party Products Disclaimer

.................... 86

9.2

Development Tools and Software

................... 86

9.3

Firmware Updates

................................... 88

9.4

Device Nomenclature

............................... 88

9.5

Documentation Support

............................. 89

9.6

CC3235MODASF Datasheet(PDF) 6 Page - Texas Instruments

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