CC3235MODASF datasheet(84/100 Pages) TI1

84 / 100 page

CC3235MODAS, CC3235MODASF

SWRS233 – OCTOBER 2019

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Environmental Requirements and SMT Specifications

8.4.3

PCB Surface Finish Requirements

A uniform PCB plating thickness is key for high assembly yield. For an electroless nickel immersion gold

finish, the gold thickness should range from 0.05 μm to 0.20 μm to avoid solder joint embrittlement. Using

a PCB with Organic Solderability Preservative (OSP) coating finish is also recommended as an alternative

to Ni-Au.

8.4.4

Solder Stencil

Solder paste deposition using a stencil-printing process involves the transfer of the solder paste through

pre-defined apertures with the application of pressure. Stencil parameters such as aperture area ratio and

the fabrication process have a significant impact on paste deposition. Inspection of the stencil prior to

placement of package is highly recommended to improve board assembly yields.

8.4.5

Package Placement

Packages can be placed using standard pick and place equipment with an accuracy of ±0.05 mm.

Component pick and place systems are composed of a vision system that recognizes and positions the

component and a mechanical system that physically performs the pick and place operation. Two

commonly used types of vision systems are:

•

A vision system that locates a package silhouette

•

A vision system that locates individual pads on the interconnect pattern

The second type renders more accurate placements but tends to be more expensive and time consuming.

Both methods are acceptable since the parts align due to a self-centering features fo the solder joint

during solder reflow. It is recommended to release the package to 1 to 2 mils into the solder paste or with

minimum force to avoid causing any possible damage to the thinner packages.

8.4.6

Solder Joint Inspection

After surface mount assembly, transmission X-ray should be used for sample monitoring of the solder

attachment process. This identifies defects such as solder bridging, shorts, opens, and voids. It is also

recommended to use side view inspection in addition to X-rays to determine if there are "Hour Glass"

shaped solder and package tilting existing. The "Hour Glass" solder shape is not a reliable joint. 90° mirror

projection can be used for side view inspection.

8.4.7

Rework and Replacement

TI recommends removal of modules by rework station applying a profile similar to the mounting process.

Using a heat gun can sometimes cause damage to the module by overheating.

8.4.8

Solder Joint Voiding

TI recommends to control solder joint voiding to be less than 30% (per IPC-7093). Solder joint voids could

be reduced by baking of components and PCB, minimized solder paste exposure duration, and reflow

profile optimization.

8.5

Baking Conditions

Products require baking before mounting if:

•

Humidity indicator cards read > 30%

•

Temp < 30°C, humidity < 70% RH, over 96 hours

Baking condition: 90°C, 12 to 24 hours

Baking times: 1 time

CC3235MODASF Datasheet(PDF) 84 Page - Texas Instruments

CC3235MODASF Datasheet(HTML) 84 Page - Texas Instruments

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