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CC3235MODASF Datasheet(PDF) 83 Page - Texas Instruments |
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CC3235MODASF Datasheet(HTML) 83 Page - Texas Instruments |
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83 / 100 page  83 CC3235MODAS, CC3235MODASF www.ti.com SWRS233 – OCTOBER 2019 Submit Documentation Feedback Product Folder Links: CC3235MODAS CC3235MODASF Environmental Requirements and SMT Specifications Copyright © 2019, Texas Instruments Incorporated 8 Environmental Requirements and SMT Specifications 8.1 PCB Bending The PCB follows IPC-A-600J for PCB twist and warpage < 0.75% or 7.5 mil per inch. 8.2 Handling Environment 8.2.1 Terminals The product is mounted with motherboard through land-grid array (LGA). To prevent poor soldering, do not make skin contact with the LGA portion. 8.2.2 Falling The mounted components will be damaged if the product falls or is dropped. Such damage may cause the product to malfunction. 8.3 Storage Condition 8.3.1 Moisture Barrier Bag Before Opened A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH. The calculated shelf life for the dry-packed product will be 24 months from the date the bag is sealed. 8.3.2 Moisture Barrier Bag Open Humidity indicator cards must be blue, < 30%. 8.4 PCB Assembly Guide The wireless MCU modules are packaged in a substrate base Leadless Quad Flatpack (QFM) package. Components were mounted onto the substrate with standard SMT process with the additional of a metal lid covering the top of the module. The module are designed with pull back leads for easy PCB layout and board mounting. 8.4.1 PCB Land Pattern & Thermal Vias We recommended a solder mask defined land pattern to provide a consistent soldering pad dimension in order to obtain better solder balancing and solder joint reliability. PCB land pattern are 1:1 to module soldering pad dimension. Thermal vias on PCB connected to other metal plane are for thermal dissipation purpose. It is critical to have sufficient thermal vias to avoid device thermal shutdown. Recommended vias size are 0.2mm and position not directly under solder paste to avoid solder dripping into the vias. 8.4.2 SMT Assembly Recommendations The module surface mount assembly operations include: • Screen printing the solder paste on the PCB • Monitor the solder paste volume (uniformity) • Package placement using standard SMT placement equipment • X-ray pre-reflow check - paste bridging • Reflow • X-ray post-reflow check - solder bridging and voids |
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