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TLE7258LE Datasheet(PDF) 18 Page - Infineon Technologies AG

Part # TLE7258LE
Description  LIN transceiver
PDF  31 Pages
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Manufacturer  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

TLE7258LE Datasheet(HTML) 18 Page - Infineon Technologies AG

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Datasheet
18
Rev. 1.20
2022-04-27
TLE7258
LIN transceiver
General product characteristics
4.2
Functional range
Note:
Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics
table.
4.3
Thermal characteristics
Note:
This thermal data was generated in accordance with JEDEC JESD51 standards. For more
information, go to www.jedec.org.
Table 4
Operating range
Parameter
Symbol
Values
Unit Note or Test Condition Number
Min.
Typ. Max.
Supply voltages
Extended supply voltage range
for operation
VS(ext)
18
40
V
Parameter deviations
possible
2.1.1
Supply voltage range for
normal operation
VS(nor)
5.5
18
V
LIN Spec 2.2A (Par. 10)
2.1.2
Thermal parameters
Junction temperature
Tj
-40
150
°C
1)
1) Not subject to production test, specified by design
2.2.1
Table 5
Thermal resistance1)
1) Not subject to production test, specified by design
Parameter
Symbol
Values
Unit Note or Test Condition
Number
Min.
Typ.
Max.
Thermal resistance, PG-DSO-8 package version
Junction ambient
RthJA
130
K/W 2)
2) Specified RthJA value is according to Jedec JESD51-2,-7 at natural convection on FR4 2s2p board; The Product
(TLE7258) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70 mm Cu, 2 x 35 mm Cu).
Where applicable a thermal via array under the exposed pad contacted to the first inner copper layer.
3.1.1
Thermal resistance, PG-TSON-8 package version
Junction ambient
RthJA
–60
K/W 2)
3.2.1
190
K/W 3)
3) Specified RthJA value is according to Jedec JESD51-3 at natural convection on FR4 1s0p board; The product
(TLE7258) was simulated on a 76.2 x 114.3 x 1.5 mm board with 1 inner copper layer (1 x 70 mm Cu).
3.2.2
70
K/W 300 mm2 heatsink on
PCB3)
3.2.3
Thermal shutdown junction temperature
Thermal shutdown
temperature
TJSD
150
175
200
°C
3.3.1
Thermal shutdown hysteresis ΔT
10
K
3.3.2



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