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PC7447AMGH1000LB Datasheet(PDF) 14 Page - ATMEL Corporation |
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PC7447AMGH1000LB Datasheet(HTML) 14 Page - ATMEL Corporation |
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14 / 44 page ![]() 14 5387B–HIREL–07/05 PC7447A [Preliminary] Figure 6-4. Thermal Performance of Select Thermal Interface Material 6.4.4.1 Heat Sink Selection Example For preliminary heat sink sizing, the die-junction temperature can be expressed as follows: T j = TI + Tr + (R θJC + Rθint + Rθsa) × Pd where: T j is the die-junction temperature T i is the inlet cabinet ambient temperature T r is the air temperature rise within the computer cabinet RθJC is the junction-to-case thermal resistance Rθint is the adhesive or interface material thermal resistance Rθsa is the heat sink base-to-ambient thermal resistance P d is the power dissipated by the device 0 0.5 1 1.5 2 010 20 30 40 50 60 70 80 Silicone Sheet (0.006 in.) Bare Joint Floroether Oil Sheet (0.007 in.) Graphite/Oil Sheet (0.005 in.) Synthetic Grease Contact Pressure (psi) |
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