PC7447AMGH1000LB datasheet(16/44 Pages) ATMEL

16 / 44 page

5387B–HIREL–07/05

PC7447A [Preliminary]

Figure 6-5.

Recommended Thermal Model of PC7447A

6.4.4.2

Temperature Diode

The PC7447A has a temperature diode on the microprocessor that can be used in conjunction

with other system temperature monitoring devices. These devices use the negative temperature

coefficient of a diode operated at a constant current to determine the temperature of the micro-

processor and its environment. For proper operation, the monitoring device used should auto-

calibrate the device by canceling out the V

BE variation of each PC7447A’s internal diode.

The following are the specifications of the PC7447A on-board temperature diode:

f > 0.40V

f < 0.90V

Operating range 2 - 300 µA

Diode leakage < 10 nA at 125

°C

Ideality factor over 5 µA – 150 µA at 60

°C: 1 <= n <= TBD

Ideality factor is defined as the deviation from the ideal diode equation:

Another useful equation is:

Bump and Underfill

Die

Substrate

Solder and Air

Die

Substrate

Side View of Model (Not to Scale)

Conductivity

Value

Unit

Bump and Underfill (7.3 x 9.3 x 0.070 mm)

W/(m x K)

Substrate (25 x 25 x 1.2 mm)

Solder Ball and Air (25 x 25 x 0.6 mm)

0.6

1.9

8.1

4.0

0.034

3.8

IfW

Is e

qVf

nKT

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–

VH VL

–

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