SC667201MMG3 datasheet(59/120 Pages) FREESCALE

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MPC5642A Microcontroller Data Sheet, Rev. 3.1

Freescale Semiconductor

Electrical characteristics

3.3.1

General notes for specifications at maximum junction temperature

An estimation of the chip junction temperature, TJ, can be obtained from Equation 1:

TJ = TA + (RJA * PD)

Eqn. 1

where:

TA = ambient temperature for the package (°C)

RJA = junction-to-ambient thermal resistance (°C/W)

PD = power dissipation in the package (W)

The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide consistent values for

estimations and comparisons. The difference between the values determined for the single-layer (1s) board compared to a

four-layer board that has two signal layers, a power and a ground plane (2s2p), demonstrate that the effective thermal resistance

is not a constant. The thermal resistance depends on the:

•

Construction of the application board (number of planes)

•

Effective size of the board which cools the component

•

Quality of the thermal and electrical connections to the planes

•

Power dissipated by adjacent components

Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to connect the package

to the planes reduces the thermal performance. Thinner planes also reduce the thermal performance. When the clearance

between the vias leave the planes virtually disconnected, the thermal performance is also greatly reduced.

7 Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter

is written as Psi-JT.

Table 11. Thermal characteristics for 324-pin TEPBGA1

1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.

Symbol

Parameter

Conditions

Value Unit

RJA CC D Junction-to-ambient, natural convection

2 Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board

meets JEDEC specification for this package.

Single-layer board – 1s

°C/W

CC D

Four-layer board – 2s2p

°C/W

RJMA CC D Junction-to-moving-air, ambient

at 200 ft./min., single-layer board – 1s

°C/W

CC D

at 200 ft./min., four-layer board – 2s2p

°C/W

RJB CC D Junction-to-board

3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC

specification for the specified package.

°C/W

RJCtop CC D Junction-to-case

4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate

temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.

7°C/W



CC D Junction-to-package top, natural convection5

5 Thermal characterization parameter indicating the temperature difference between the package top and the

junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization

parameter is written as Psi-JT.

2°C/W

SC667201MMG3 Datasheet(PDF) 59 Page - Freescale Semiconductor, Inc

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