MP2005 datasheet(2/10 Pages) MPS

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MP2005 – 800mA, HIGH PSRR,ULDO LINEAR REGULATOR

MP2005 Rev. 0.92

www.MonolithicPower.com

5/5/2010

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

Free Air Temperature (TA)

MP2005DD

QFN8 (2mm x 3mm)

–40

°C to +85°C

* For Tape & Reel, add suffix –Z (e.g. MP2005DD–Z)

For RoHS compliant packaging, add suffix –LF (e.g. MP2005DD–LF–Z)

PACKAGE REFERENCE

TOP VIEW

BIAS

GND

OUT

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

ABSOLUTE MAXIMUM RATINGS (1)

VBIAS, VIN to GND............................–0.3V to +6V

FB, EN to GND ................................–0.3V to 6V

OUT .................................................–0.3V to 6V

Continuous Power Dissipation (TA = +25°C)

(2)

................................................................... 2.3W

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature ............. –65°C to +150

°C

Recommended Operating Conditions

(3)

Input Voltage VIN .............................1.0V to 5.5V

Input Voltage VBIAS ..........................2.7V to 5.5V

Output Voltage................................0.5V to 4.0V

Load Current...........................800mA Maximum

Operating Temperature............. –40

°C to +85°C

Thermal Resistance

(4)

θJA

θJC

QFN8 (2mm x 3mm)............... 55 ...... 12...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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