TNETV1647GSTZWT datasheet(59/236 Pages) TI1

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DM644x DMSoC:

DM6441

DM6444

DM6442

DM6446

DM6443

DM6447

PREFIX

DEVICE SPEED RANGE

TMS 320 DM6441

ZWT

405

TMX = Experimental device

TMP = Prototype device

TMS = Qualified device

SMX= Experimental device, MIL

SMJ = MIL-PRF-38535, QML

SM = High Rel (non-38535)

DEVICE FAMILY

320 = TMS320t DSP family

PACKAGE TYPE(A)

ZWT = 361-pin plastic BGA, with Pb-free soldered balls

DEVICE(B)

TEMPERATURE RANGE (DEFAULT: 0

°C TO 85°C)

(

)

Blank = 0

°C to 85°C

405 (405-MHz DSP, 202.5−MHz ARM9 at 1.05V)

513 (513-MHz DSP, 256-MHz ARM9 at 1.2V)

A. BGA = Ball Grid Array

B. For actual device part numbers (P/Ns) and ordering information, see the TI website (http://www.ti.com).

S (

)

SILICON REVISION

0 = Initial Silicon

A = Silicon 2.1

B = Silicon 2.3

ROM SECURITY

S = Secure

N = Non-secure

TMS320DM6441

www.ti.com

SPRS359E – SEPTEMBER 2006 – REVISED AUGUST 2010

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the

package type (for example, ZWT), the temperature range (for example, "Blank" is the commercial

temperature range).

Figure 2-6 provides a legend for reading the complete device name for any SoC platform member.

Figure 2-6. Device Nomenclature

Device Overview

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Product Folder Link(s): TMS320DM6441

TNETV1647GSTZWT Datasheet(PDF) 59 Page - Texas Instruments

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