TLE7258

General Product Characteristics

Data Sheet

18

Rev. 1.1, 2015-08-20

5.2

Functional Range

Note: Within the functional range the IC operates as described in the circuit description. The electrical

characteristics are specified within the conditions given in the related electrical characteristics table.

5.3

Thermal Characteristics

Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go

to www.jedec.org.

Table 4

Operating Range

Parameter

Symbol

Values

Unit

Note / Test Condition

Number

Min.

Max.

Supply Voltages

Extended supply voltage range

for operation

V

S(ext)

18

40

V

Parameter deviations

possible

2.1.1

Supply voltage range for normal

operation

V

S(nor)

5.5

18

V

LIN Spec 2.2A (Par. 10)

2.1.2

Thermal Parameters

Junction temperature

T

j

-40

150

°C

1)

1) Not subject to production test, specified by design

2.2.1

Table 5

1) Not subject to production test, specified by design

Parameter

Symbol

Values

Unit Note / Test Condition

Num

ber

Min.

Typ.

Max.

Thermal Resistance, PG-DSO-8 Package Version

Junction ambient

R

thJA

–

130

–

K/W

2)

2) Specified

R

was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70 mm Cu, 2 x 35 mm Cu). Where

applicable a thermal via array under the exposed pad contacted to the first inner copper layer.

3.1.1

Thermal Resistance, PG-TSON-8 Package Version

Junction ambient

R

thJA

–60

–

K/W

2)

3.2.1

–

190

–

K/W

3)

3) Specified

R

was simulated on a 76.2 x 114.3 x 1.5 mm board with 1 inner copper layer (1 x 70 mm Cu).

3.2.2

–70

–

K/W

Thermal Shutdown Junction Temperature

Thermal shutdown temperature

T

JSD

150

175

200

°C

–

3.3.1

Thermal shutdown hysteresis

∆

T

–

10

–

K

–

3.3.2