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MCP660 Datasheet(PDF) 34 Page - Microchip Technology |
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MCP660 Datasheet(HTML) 34 Page - Microchip Technology |
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34 / 68 page ![]() MCP660/1/2/3/4/5/9 DS20002194E-page 34 2009-2014 Microchip Technology Inc. 6-Lead Plastic Small Outline Transistor (CHY) [SOT-23] Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 6 Pitch e 0.95 BSC Outside Lead Pitch e1 1.90 BSC Overall Height A 0.90 – 1.45 Molded Package Thickness A2 0.89 – 1.30 Standoff A1 0.00 – 0.15 Overall Width E 2.20 – 3.20 Molded Package Width E1 1.30 – 1.80 Overall Length D 2.70 – 3.10 Foot Length L 0.10 – 0.60 Footprint L1 0.35 – 0.80 Foot Angle 0° – 30° Lead Thickness c 0.08 – 0.26 Lead Width b 0.20 – 0.51 b E 4 N E1 PIN1IDBY LASER MARK D 1 2 3 e e1 A A1 A2 c L L1 φ Microchip Technology Drawing C04-028B |
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