MCP660 datasheet(63/68 Pages) MICROCHIP

63 / 68 page

 2009-2014 Microchip Technology Inc.

DS20002194E-page 63

MCP660/1/2/3/4/5/9

APPENDIX A: REVISION HISTORY

Revision E (July 2014)

The following is the list of modifications:

Updated the Features: list.

Updated the Typical Application Circuit and

added the High Gain-Bandwidth Op Amp

Portfolio table in the Features: section.

Updated Figures 4-6, 4-10 and 4-11.

Updated

the

Section 6.0

“Packaging

Information”

and

Section 6.1

“Package

Marking Information” sections.

Minor typographical changes.

Revision D (March 2012)

The following is the list of modifications:

Added the MSOP (8L) package for MCP662 and

all related information throughout the document.

Revision C (November 2011)

The following is the list of modifications:

Added the SOT-23 (5L) and TDFN (8L) package

option for MCP661 and SOT-23 (6L) package

options for MCP663 and the related information

throughout the document. Updated Package

Types drawing with pin designation for each

new package.

Updated the Temperature Specifications table to

show the temperature specifications for new

packages.

Updated Table 3-1 to show all the pin functions.

Updated

Section 6.0

“Packaging

Information” with markings for the new

additions. Added the corresponding SOT-23 (5L

and 6L) and 2x3 TDFN (8L) package options

and related information.

Updated table description and examples in the

Product Identification System section.

Revision B (September 2011)

The following is the list of modifications:

Added the MCP660, MCP664 and MCP669

amplifiers to the product family and the related

information throughout the document.

Added the 4x4 QFN (16L) package option for

MCP660 and MCP669, SOIC and TSSOP (14L)

package options for MCP660 and MCP665 and

the

information

throughout

the

document. Updated the Package Types

drawing with pin designation for each new

package.

Updated the Temperature Specifications table to

show the temperature specifications for new

packages.

Updated Table 3-1 to show all the pin functions.

Updated

Section 6.0

“Packaging

Information” with markings for the new

additions. Added the corresponding SOIC and

TSSOP (14L), and 4x4 QFN (16L) package

options and related information.

Updated table description and examples in

Product Identification System.

Revision A (July 2009)

Original release of this document.

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