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M69KB096AB Datasheet(PDF) 70 Page - STMicroelectronics |
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M69KB096AB Datasheet(HTML) 70 Page - STMicroelectronics |
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70 / 73 page ![]() 10 Wafer and die specifications M69KB096AB 70/73 69 VCCQ -1,846.54 -2,317.02 -0.0726984 -0.0912211 70 DQ8 -1,965.54 -2,317.02 -0.0773835 -0.0912211 71 DQ0 -2,084.54 -2,317.02 -0.0820685 -0.0912211 1. Reference from the center of each bond pad to the center of the die (0,0). 2. DNU stands for ‘do not use’. |
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