ST7LUS5 datasheet(112/124 Pages) STMICROELECTRONICS

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Package characteristics

ST7LUS5, ST7LU05, ST7LU09

112/124

Package characteristics

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK® is an ST trademark. ECOPACK® specifications are available at: www.st.com.

13.1

Package mechanical data

Figure 60.

8-pin plastic small outline package, 150-mil width

h x 45°

Dim.

inches(1)

Values in inches are converted from mm

and rounded to 3 decimal digits.

Min

Typ

Max

Min

Typ

Max

1.35

1.75

0.053

0.069

0.10

0.25

0.004

0.010

1.10

1.65

0.043

0.065

0.33

0.51

0.013

0.020

0.19

0.25

0.007

0.010

4.80

5.00

0.189

0.197

3.80

4.00

0.150

0.158

1.27

0.050

5.80

6.20

0.228

0.244

0.25

0.50

0.010

0.020

0.40

1.27

0.016

0.050

Number of pins

Table 85.

Thermal characteristics

Symbol

Ratings

Package

Value

Unit

RthJA

Package thermal resistance (junction to ambient)

SO8

130

°C/W

TJmax

Maximum junction temperature(1)

150

°C

PDmax

Power dissipation(2)

180

The maximum chip-junction temperature is based on technology characteristics.

The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA.

The power dissipation of an application can be defined by the user with the formula: PD =PINT +PPORT where PINT is the

chip internal power (IDD x VDD) and PPORT is the port power dissipation depending on the ports used in the application.

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