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HC705RC16GRS/D Datasheet(PDF) 19 Page - NXP Semiconductors |
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HC705RC16GRS/D Datasheet(HTML) 19 Page - NXP Semiconductors |
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19 / 120 page  General Description Signal Description MC68HC705RC16 — Rev. 3.0 General Release Specification General Description 1.5 Signal Description Pinout for the 28-pin dual in-line package (DIP) is shown in Figure 1-2. Figure 1-3 provides the pinout for the 28-pin small outline integrated circuit (SOIC) package. Figure 1-4 shows the pinout for the 44-lead plastic leaded chip carrier (PLCC). The signals are described in the following subsections. Figure 1-2. 28-Pin DIP Pinout Figure 1-3. 28-Pin SOIC Assignments PB4 PB5 PB6 PB7 PA0 PA1 PA2 PA3 PA4 PA5 OSC1 OSC2 VDD VSS PC1 PC2 PC3 PB1 PB2 PC0 PB0 PB3 IRQ/VPP RESET PA7 PA6 LPRST IRO 5 6 7 8 9 10 11 12 13 14 2 3 1 4 24 23 22 21 20 19 18 17 16 15 27 26 28 25 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 PA2 PA3 PA4 PA5 RESET IRO VSS LPRST PC3 PC2 PC1 PC0 PA7 PA6 PA1 PA0 PB7 PB6 PB5 PB3 PB2 PB1 PB0 OSC1 OSC2 VDD PB4 IRQ/VPP Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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