PCF2123TS datasheet(46/55 Pages) NXP

46 / 55 page

PCF2123_2

Product data sheet

Rev. 02 — 4 December 2009

46 of 55

NXP Semiconductors

PCF2123

SPI Real time clock/calendar

[1]

The x/y coordinates of the alignment mark location represent the position of the REF point (see Figure 34)

with respect to the center (x/y = 0) of the chip; see Figure 32 and Figure 33.

[2]

The x/y values of the dimensions represent the extensions of the alignment mark in direction of the

coordinate axis (see Figure 34).

Table 47.

Bump locations

All x/y coordinates represent the position of the center of each pad with respect to the center

(x/y = 0) of the chip; see Figure 33.

Symbol

Bump

Coordinates

SDO

648.0

−575.0

SDI

648.0

−377.0

SCL

648.0

−179.0

CLKOE

648.0

171.2

CLKOUT

648.0

369.2

VDD

648.0

625.7

OSCI

−648.0

639.0

OSCO

−648.0

421.9

TEST

−648.0

−25.9

INT

−648.0

−223.9

−648.0

−441.0

VSS

−648.0

−639.0

Table 48.

Alignment mark dimension and location

Coordinates

Location[1]

693

−516.2

Dimension

µm13 µm

Fig 34. Alignment mark

013aaa231

REF

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