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STM32F050C4 Datasheet(PDF) 89 Page - STMicroelectronics |
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STM32F050C4 Datasheet(HTML) 89 Page - STMicroelectronics |
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89 / 97 page  STM32F050xx Package characteristics Doc ID 023683 Rev 1 89/97 Figure 36. UFQFPN28 - 4 x 4 mm, 28-lead ultra thin fine pitch quad flat no-lead package outline 1. Drawing is not to scale. 2. Dimensions are in millimeters. 3. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. X Table 63. UFQFPN28 – 4 x 4 mm, 28-lead ultra thin fine pitch quad flat no-lead package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.5 0.55 0.6 0.0197 0.0217 0.0236 A1 -0.05 0 0.05 -0.002 0 0.002 D 3.9 4 4.1 0.1535 0.1575 0.1614 D1 2.9 3 3.1 0.1142 0.1181 0.122 E 3.9 4 4.1 0.1535 0.1575 0.1614 E1 2.9 3 3.1 0.1142 0.1181 0.122 L 0.3 0.4 0.5 0.0118 0.0157 0.0197 L1 0.25 0.35 0.45 0.0098 0.0138 0.0177 T 0.152 0.006 b 0.2 0.25 0.3 0.0079 0.0098 0.0118 e 0.5 0.0197 1. Values in inches are converted from mm and rounded to 4 decimal digits. |
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