S29AS016J datasheet(3/59 Pages) CYPRESS

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Document Number: 002-01122 Rev.*L

Page 3 of 59

S29AS016J

Contents

Product Selector Guide ............................................... 4

Block Diagram.............................................................. 4

Connection Diagrams.................................................. 5

3.1

Standard TSOP.............................................................. 5

3.2

FBGA Connection Diagram, 8.15 mm x 6.15 mm (VBK048)

3.3

FBGA Connection Diagram, 6.0 mm x 4.0 mm (VDF048)

3.4

Special Handling Instructions......................................... 7

Pin Configuration......................................................... 8

Logic Symbol ............................................................... 8

Ordering Information ................................................... 9

6.1

S29AS016J Standard Products ..................................... 9

Device Bus Operations.............................................. 10

7.1

Word/Byte Configuration.............................................. 11

7.2

Requirements for Reading Array Data......................... 11

7.3

Writing Commands/Command Sequences.................. 11

7.4

Program and Erase Operation Status.......................... 11

7.5

Standby Mode.............................................................. 11

7.6

Automatic Sleep Mode................................................. 12

7.7

RESET#: Hardware Reset Pin..................................... 12

7.8

Output Disable Mode ................................................... 12

7.9

Autoselect Mode .......................................................... 12

7.10 Sector Address Tables................................................. 13

7.11 Sector Group Protection/Unprotection ......................... 16

7.12 Temporary Sector Group Unprotect............................. 19

7.13 Write Protect (WP#) ..................................................... 19

7.14 Hardware Data Protection............................................ 20

Secured Silicon Sector Flash Memory Region ....... 21

8.1

Factory Locked: Secured Silicon Sector Programmed

and Protected at the Factory........................................ 21

8.2

Customer Lockable: Secured Silicon Sector NOT Pro-

grammed

or Protected at the Factory .......................................... 21

Common Flash Memory Interface (CFI) ................... 23

10.

Command Definitions................................................ 27

10.1 Reading Array Data ..................................................... 27

10.2 Reset Command .......................................................... 27

10.3 Autoselect Command Sequence ................................. 27

10.4 Enter Secured Silicon Sector/Exit Secured Silicon

Sector Command Sequence........................................ 28

10.5 Word/Byte Program Command Sequence................... 28

10.6 Unlock Bypass Command Sequence .......................... 28

10.7 Chip Erase Command Sequence ................................ 29

10.8 Sector Erase Command Sequence ............................. 30

10.9 Erase Suspend/Erase Resume Commands ................ 30

11.

Command Definitions................................................ 32

12.

Write Operation Status .............................................. 36

12.1 DQ7: Data# Polling ...................................................... 36

12.2 RY/BY#: Ready/Busy#................................................. 37

12.3 DQ6: Toggle Bit I .......................................................... 37

12.4 DQ2: Toggle Bit II ......................................................... 38

12.5 Reading Toggle Bits DQ6/DQ2..................................... 38

12.6 DQ5: Exceeded Timing Limits ...................................... 39

12.7 DQ3: Sector Erase Timer.............................................. 39

13.

Absolute Maximum Ratings....................................... 41

14.

Operating Ranges ....................................................... 41

15.

DC Characteristics...................................................... 42

15.1 CMOS Compatible ........................................................ 42

16.

Test Conditions ........................................................... 43

17.

Key to Switching Waveforms..................................... 43

18.

AC Characteristics...................................................... 44

18.1 Read Operations........................................................... 44

18.2 Hardware Reset (RESET#)........................................... 45

18.3 Word/Byte Configuration (BYTE#) ................................ 46

18.4 Erase/Program Operations ........................................... 47

18.5 Temporary Sector Group Unprotect.............................. 50

18.6 Alternate CE# Controlled Erase/Program Operations .. 51

19.

Erase and Programming Performance ..................... 53

20.

Package Pin Capacitance........................................... 53

21.

Physical Dimensions .................................................. 54

21.1 TS 048 - 48-Pin Standard TSOP .................................. 54

21.2 VBK048—48-Ball Fine-Pitch Ball Grid Array

(FBGA) 8.15 mm x 6.15 mm ......................................... 55

21.3 VDF048—48-Ball Fine-Pitch Ball Grid Array

(FBGA) 6.00 mm x 4.00 mm ......................................... 56

22.

Document History ....................................................... 57

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