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HC705P6AGRS/D Datasheet(PDF) 129 Page - NXP Semiconductors |
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HC705P6AGRS/D Datasheet(HTML) 129 Page - NXP Semiconductors |
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129 / 134 page ![]() MC68HC705P6A — Rev. 1.0 General Release Specification Mechanical Specifications General Release Specification — MC68HC705P6A Section 15. Mechanical Specifications 15.1 Contents 15.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .129 15.3 Plastic Dual In-Line Package (Case 710) . . . . . . . . . . . . . . . .130 15.4 Small Outline Integrated Circuit Package (Case 751F) . . . . .130 15.2 Introduction The MC68HC705P6A is available in either a 28-pin plastic dual in-line (PDIP) or a 28-pin small outline integrated circuit (SOIC) package. The following figures show the latest packages at the time of this publication. To make sure that you have the latest package specifications, contact one of the following: • Local Motorola Sales Office • Motorola Mfax – Phone 602-244-6609 – EMAIL rmfax0@email.sps.mot.com • Worldwide Web (wwweb) at http://design-net.com Follow Mfax or wwweb on-line instructions to retrieve the current mechanical specifications. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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