3

Maximum ratings

Table 2. Absolute maximum ratings

Symbol

Parameter

Value

Unit

VCC

Positive power supply voltage (steady-state)

-0.3 to 18

V

Positive power supply voltage (max. 100 ms)

-0.3 to 25

VOUT/source

(max. 100 ms)

-0.3 to Vcc+0.3

V

I-Limit

(max. 100 ms)

-0.3 to 25

V

En/fault

-0.3 to 7

V

dv/dt

-0.3 to 7

V

Top

Operating junction temperature range

-40 to 125

°C

TSTG

Storage temperature range

-65 to 150

°C

TLEAD

Lead temperature (soldering) 10 s

260

°C

1. The thermal limit is set above the maximum thermal ratings. It is not recommended to operate the device at temperatures greater than the

maximum ratings for extended periods of time.

Note:

Absolute maximum ratings are those values beyond which damage to the device may occur. Functional

operation under these conditions is not implied.

Table 3. Thermal data

Symbol

Parameter

Value

Unit

RthJA

Thermal resistance junction-ambient

52.7

°C/W

RthJC

Thermal resistance junction-case

17.4

°C/W

1. The value refers to the package mounted on a 4 layer JEDEC standard test board with 4 thermal vias connecting the thermal land to the first

buried plane.

Table 4. ESD performance

Symbol

Parameter

Test condition

Value

Unit

ESD

ESD protection

HBM

2

kV

MM

200

V

CDM

500

V

STEF12E

Maximum ratings

DS12800 - Rev 2

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