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ADBMS2950BCCSZ Datasheet(PDF) 70 Page - Analog Devices

Part # ADBMS2950BCCSZ
Description  Battery Pack Monitor
PDF  97 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADBMS2950BCCSZ Datasheet(HTML) 70 Page - Analog Devices

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ADBMS2950B
Data Sheet
Rev. 0 | Page 70 of 97
Figure 50. Internal ESD Protection Structures
Overvoltage Protection
To meet the accuracy specifications, the current and voltage
sense input signals must stay within the operating conditions
listed in the electrical characteristics of the ADCs under
differential and input-pin voltage range.
The absolute maximum ratings and the internal protection
structures allow to design an application circuitry that can
withstand various external stress conditions without the need
for external protection devices such as clamping or Zener
diodes. External diodes connected directly to the analog input
pins can even be unfavorable as their leakage current together
with the external source impedance may cause additional
measurement errors.
The analog voltage inputs (Vx, VBATx), VREF1P25 and OCA,
OCB can sink and source currents independent of whether the
ADBMS2950B is powered or unpowered. Currents can be
sourced by internal diode clamps from the GND pin and sunk
by internal diode clamps to the VREG pin. Even if the IC is
unpowered and the VREG pin is charged by clamping currents, it
consumes at least the sum of currents into V1 to V10, VBAT1,
VBAT2, VREF1P25, OCA, and OCB as specified in the Table 18
without the risk of violating the absolute maximum voltage
rating of any of those pins.
Sourcing currents, also independent of the power state of the
ADBMS2950B, must be limited below the absolute maximum
ratings of the pins and are not constrained by this sum of
currents maximum rating, but the power dissipation in the
internal diodes must be considered. As the currents into pins
must be limited by the application circuitry below the sum of
current maximum rating, it is also ensured that the power
dissipation is well-limited in the sourcing current condition.
CURRENT SENSE INPUTS
The current sense inputs I1 and I2 using the input pins I1A,
I1B, I2A, and I2B are internally connected to I1ADC, I2ADC,
OC1ADC, and OC2ADC. Identical external circuits must be
connected to S1A, I1A, I1B, S2A, I2A, and I2B with the circuit
input of S1A shorted to the circuit input of I1A and the circuit
input of S2A shorted to the circuit input of I2A leading to a
differential zero signal of I1A vs. S1A and I2A vs. S2A, see
Figure 51.
One side of the current sense resistor must be connected to PCB
GND to which also the RGND, SGND, and GND pins of the IC
are connected. It is recommended to connect the A-side (IxA,
SxA) of the shunt to GND and to BAT−.



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