OPTION_REG datasheet(14/222 Pages) MICROCHIP

14 / 222 page

MCP19111

DS22331A-page 14

 2013 Microchip Technology Inc.

2.1.23

PHASE PIN

The PHASE pin provides the return path for the high-

side gate driver. The source of the high-side MOSFET,

drain of the low-side MOSFET and the inductor are

connected to this pin.

2.1.24

BOOT PIN

The BOOT pin is the floating bootstrap supply pin for

the high-side gate driver. A capacitor is connected

between this pin and the PHASE pin to provide the

necessary charge to turn on the high-side MOSFET.

2.1.25

+VSEN PIN

The non-inverting input of the unity gain amplifier used

for output voltage remote sensing is connected to the

+VSEN pin. This pin can be internally pulled-up to VDD

by setting PE1<PUEN> bit.

2.1.26

-VSEN PIN

The inverting input of the unity gain amplifier used for

output voltage remote sensing is connected to the

-VSEN pin. This pin can be internally pull-down to GND

by setting PE1<PDEN> bit.

2.1.27

+ISEN PIN

The non-inverting input of the current sense amplifier is

connected to the +ISEN pin.

2.1.28

-ISEN PIN

The inverting input of the current sense amplifier is

connected to the -ISEN pin.

2.1.29

EXPOSED PAD (EP)

There is no internal connection to the Exposed Thermal

Pad. The EP should be connected to the GND pin and

to the GND PCB plane to aid in the removal of the heat.

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