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ST7632 Datasheet(PDF) 2 Page - Sitronix Technology Co., Ltd. |
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ST7632 Datasheet(HTML) 2 Page - Sitronix Technology Co., Ltd. |
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2 / 96 page ![]() ST7632 Ver 1.7 2/96 2006/08/15 3. ST7632 Pad Arrangement (COG) Chip Size: 19,550 um × 1,473 um Bump Pitch: PAD NO 1 ~ 496, 632~663: 40 um (COM/SEG), PAD NO 497 ~ 631: 110 um (I/O) Bump size: PAD NO.1~464: 25(x)um X 110(y)um PAD No.465~496, 632~663: 110(x)um X 25(y)um PAD N0. 497~631: 90(x)um X 40(y)um Bump Height: 17um Chip Thickness: 635 um 632 663 X Y 1 465 496 497 631 (0,0) 630 498 464 463 unit: um (-174,-483) 40 81.75 40 25 unit: um (-7909.1,189.69) 45 60 30 30 unit: um (9427.36, -645.88) 45 60 30 30 25 110 Bump size of PAD 1~464 unit: um 90 40 Bump size of PAD 497 ~ 631 unit: um 25 110 Bump size of PAD 465~496 PAD 632~663 unit: um |
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