TPS65982ABZBHR datasheet(2/121 Pages) TI1

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TPS65982

SLVSD02D – MARCH 2015 – REVISED JUNE 2019

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Table of Contents

Features .................................................................. 1

Applications ........................................................... 1

Description ............................................................. 1

Revision History..................................................... 2

Description (continued)......................................... 4

Pin Configuration and Functions ......................... 5

Specifications....................................................... 10

7.1

Absolute Maximum Ratings .................................... 10

7.2

ESD Ratings............................................................ 10

7.3

Recommended Operating Conditions ..................... 11

7.4

Thermal Information ................................................ 11

7.5

Power Supply Requirements and Characteristics... 12

7.6

Power Supervisor Characteristics ........................... 13

7.7

Power Consumption Characteristics ....................... 13

7.8

Cable Detection Characteristics.............................. 14

7.9

USB-PD Baseband Signal Requirements and

Characteristics ......................................................... 15

7.10

USB-PD TX Driver Voltage Adjustment

Parameter ................................................................ 15

7.11

Port Power Switch Characteristics........................ 16

7.12

Port Data Multiplexer Switching Characteristics ... 19

7.13

Port Data Multiplexer Clamp Characteristics ........ 21

7.14

Port Data Multiplexer SBU Detection

Characteristics ......................................................... 21

7.15

Port Data Multiplexer Signal Monitoring Pullup and

Pulldown Characteristics.......................................... 21

7.16

Port Data Multiplexer USB Endpoint

Characteristics ......................................................... 21

7.17

Port Data Multiplexer BC1.2 Detection

Characteristics ......................................................... 22

7.18

Analog-to-Digital Converter (ADC)

Characteristics ......................................................... 22

7.19

Input/Output (I/O) Characteristics ......................... 22

7.20

I2C Slave Characteristics ...................................... 24

7.21

SPI Master Characteristics ................................... 25

7.22

BUSPOWERZ Configuration Characteristics........ 25

7.23

Thermal Shutdown Characteristics ....................... 26

7.24

Oscillator Characteristics ...................................... 26

7.25

Single-Wire Debugger (SWD) Timing

Requirements........................................................... 26

7.26

HPD Timing Requirements ................................... 26

7.27

Typical Characteristics .......................................... 27

Parameter Measurement Information ................ 28

Detailed Description ............................................ 31

9.1

Overview ................................................................. 31

9.2

Functional Block Diagram ....................................... 32

9.3

Feature Description................................................. 32

9.4

Device Functional Modes........................................ 69

9.5

Programming .......................................................... 76

Application and Implementation........................ 81

10.1

Application Information.......................................... 81

10.2

Typical Applications .............................................. 81

Power Supply Recommendations ..................... 91

11.1

3.3-V Power .......................................................... 91

11.2

1.8 V Core Power.................................................. 91

11.3

VDDIO................................................................... 91

Layout................................................................... 93

12.1

Layout Guidelines ................................................. 93

12.2

Layout Example .................................................... 98

Device and Documentation Support ............... 112

13.1

Device Support.................................................... 112

13.2

Documentation Support ...................................... 112

13.3

Receiving Notification of Documentation

Updates.................................................................. 112

13.4

Community Resources........................................ 112

13.5

Trademarks ......................................................... 112

13.6

Electrostatic Discharge Caution .......................... 112

13.7

Glossary .............................................................. 112

Mechanical, Packaging, and Orderable

Information ......................................................... 112

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (August 2016) to Revision D

Page

•

Added NFBGA package to the Device Information table ....................................................................................................... 1

•

Added NFBGA package to the Pin Configuration and Functions section .............................................................................. 5

•

Added NFBGA package to the Thermal Information table ................................................................................................... 11

Changes from Revision B (May 2016) to Revision C

Page

•

Added the HRESET I/O voltage parameter to the Absolute Maximum Ratings table.......................................................... 10

•

Changed the value for the HBM from ±2000 to ±1500 in the ESD Ratings table ................................................................ 10

•

Changed the maximum values for the ILDO_3V3 (50 to 70 mA) and ILDO_3V3EX (10 to 30 mA) current parameters

in the Power Supply Requirements and Characteristics ...................................................................................................... 12

•

Updated the GPIO_RPU parameter to show values for DEBUG_CTL1/2 separately in the Input/Output (I/O)

Characteristics table ............................................................................................................................................................. 23

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